| PART |
Description |
Maker |
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| ZTT-MT-20.000 ZTT-MX-20.000 ZTT-MG-20.000 ZTA ZTA- |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| WCSMCFC-32.768KHZ- WCSMCF-32.768KHZ-6 WCSMCC-32.76 |
4 Pad Ceramic SMD Package
|
MMD Components
http://
|
| IL3Y-HX5F6.0-32.768 IL3Y-HX5F12.5-32.768 |
2 Pad Glass Package Quartz Crystal, 1.5 mm x 4.1 mm
|
ILSI America LLC
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| SSOP-16 |
Package Outline
|
Global Mixed-mode Techn...
|
